Failure Analysis Equipment Understand Root Cause Of Failure To Prevent Similar Incidences Later
Failure analysis in the semiconductor industry refers to an
engineering approach to determine why and how a semiconductor
component is not functioning in a desired way. Usually, failures are
caused owing to improper maintenance, manufacturing defects, design
errors, assembly errors, inadequate quality assurance, improper heat
treatments, and inadequate environmental protection.
Dual-beam Technology Segment to Lead Global Failure Analysis
Equipment Market in Semiconductor Industry
The global failure analysis equipment market in the semiconductor
industry is segmented into transmission electron microscope (TEM),
scanning electron microscope (SEM), dual beam (FIB/SEM) systems,
focused ion beam system (FIB), and transmission electron microscope
(TEM).
According to research, the expanding usage of focused ion beam
systems was responsible for leading the segment to the topmost
position in terms of revenue in 2013. However, market watchers
predict that the dual beam systems (FIB/SEM) segment will surpass all
other segments to be the fastest growing one, due to the wide range
of benefits it provides over single-beam FIB systems. The dual beam
systems (FIB/SEM) segment is expected to grow at a stupendous CAGR of
5.8% in the forecast period. Depending on the types of users, the
failure analysis equipment market in the semiconductor industry is
segmented into fabless FA labs, specialty labs, fab failure analysis
(FA) labs, and others.
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Dr. Lynwood Swanson, founder of FEI, received a Heritage Award for
his ingenious contribution to the development of ion and electron
microscopy in the dual-beam technology field. His designs have helped
manufacturers ease the challenges of making devices with “sub-micron”
dimensions. The innovations in ion beam milling technology have
helped manufacturers get a clearer picture of the defect, thus
assisting them in diagnosing the root cause of the problem. This
precision offered by the dual-beam technology is likely to change the
shape of this segment in the forecast period.
A new report has been published by Transparency Market Research,
titled “Failure Analysis Equipment Market - Global Industry
Analysis, Size, Share, Growth, Trends and Forecast 2014 - 2020”.
TMR, a market intelligence company based in the U.S., states in its
report that the global failure analysis equipment market in the
semiconductor industry was estimated to be worth US$1.28 billion in
2013 and is growing at a CAGR of 4.5% between 2014 and 2020.Failure
analysis is termed as an engineering approach to uncover how and why
a component or equipment is not working in the desired manner. For
the most part, failures are brought about because of manufacturing
defects, improper maintenance, assembly errors, misuse or abuse,
design errors, fastener failure, improper material, unforeseen
operating conditions, improper heat treatments, inadequate quality
assurance, casting discontinuities, and inadequate environmental
protection\control.
Browse the full Failure Analysis Equipment Market in Semiconductor
Industry - Global Industry Analysis, Size, Share, Growth, Trends and
Forecast 2014 - 2020 report at
http://www.transparencymarketresearch.com/failure-analysis-equipment-in-semiconductor-industry.html
Growth of Infrastructure to Keep Asia Pacific in the Leading
Position
Geographically, the global failure analysis equipment market in the
semiconductor industry is segmented into Asia Pacific, North America,
Europe, and Rest of the World (RoW). The report suggests that Asia
Pacific generated maximum revenue in this market and held nearly half
the global market in 2013. This hierarchy is expected to continue due
to monumental growth in semiconductor technology and increasing
investment in education and research infrastructure in this region.
Major players across the four
regional segments of the global failure analysis equipment market in
the semiconductor industry include FEI, Hitachi High-Technologies
Corporation, Carl Zeiss SMT GmbH, and JEOL, Ltd.
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